Offers and Services

Material characterization and failure analysis

OFFER:

Non destructive or destructive failure analysis for components, packages...
Thickness and flatness characterization for conductive, insulating or semiconductor layers
Chemical and mechanical analysis for solid, liquid or powder-like material
Electrical test for components and 8'' wafer, temperature between 20 and 200°C

ACHIEVEMENTS:

3D X-Ray analysis

Metallic multi-layer characterization

SEM analysis

EQUIPMENT:

2D/3D X-Ray

Electro-mechanical characterization