Offers and Services

OFFER on packages, reel to reel film and flexible or rigid PCB

• Grinding and sawing for standard or muli-project wafers between 4 and 12 inches 
• Die bonding with standard or automatic process, conductive or non conductive glue, flip-chip process is available, die shear
• Soldering for passive components (resistance, capacitor ..)
• Ball bonding process with gold wire, 25 µm and 15µm, between 150°C and 250°C, pull test, ball shear
• Glop top or dam and fill process with resin or lid laying, module insertion in card