MicroPackaging

Die preparation

OFFER

Grinding wafers between 4 and 12 inches and individual dice up to 75 µm, plasma stress release
Sawing for standard or muli-project wafers between 4 and 12 inches, processes DBG and half cut available
Sawing quartz, sapphire samples...
Automatic picking for dice on wafer and put in gel pack. Die size could be from 500 µm² to 2 cm*3 cm
Compatibility with waffle pack, Gel Box or wafer on frame

ACHIEVEMENTS:

Silicon wafer

Grinding and sawing wafer

Scribe line

EQUIPMENT:

Wafer Mounter

Grinding

Sawing