Component transfer by flip-chip process, thermocompression up to 17 kg at 250°C
Bonding and wiring on antenna, rigid and flexible PCB, reel to reel film
Bonding on PCB in front and back side
Ball bonding : gold wire 15 µm; 150°C to 250°C
Realization of study feasability according to your needs
ACHIEVEMENTS:
Confidential
EQUIPMENT:
Pick and Place equipment purchased with the 2018 FEDER funding
Automatic glob top module
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